Under the Production Linked Incentive (PLI) scheme for telecom and networking products, 42 applicant companies (including 28 MSMEs) made cumulative investments of Rs 3,925 crore and exports of up to Rs 12,384 crore (up to 30 September), the government informed Parliament. . Wednesday. This PLI scheme was launched in June 2021 with a total financial outlay of Rs 12,195 crore. As of September, the petitioner companies had made total sales of Rs 65.32 billion, Minister of State for Communications Dr Chandra Shekhar Pemmasani told the Lok Sabha in a written reply to a question.
Key features of the plan are 33 telecom and network products, incentives ranging from 4 to 7 percent, an additional 1 percent incentive for MSMEs for the first three years and an additional 1 percent incentive for “designed” products. in India”. The Minister reported that to promote local manufacturing, the Telecommunications Technology Development Fund (TTDF) plan was launched in 2022 with the objective of financing research and development of technologies, products and services to provide telecommunications services in areas rural and remote.
Another scheme, the Digital Communications Innovation Square (DCIS), was launched in 2021 to support the translation of innovative engineering ideas and knowledge into pilot-scale operations, field implementation or viable technology development. Large Scale Electronics Manufacturing PLI Scheme was made to provide incentives on incremental sales (in the base year) to eligible companies involved in mobile phone manufacturing and manufacturing of specified electronic components including assembly, testing , marking and packaging (ATMP), notified in 2020. Units.
The Semiconductor and Electronic Component Manufacturing Promotion Scheme (SPECS) was notified in 2020 to provide a 25 per cent financial incentive on capital expenditure for an identified list of electronic products, including downstream value of the product chain. electronics involved, that is, the electronics. . Components, semiconductor/display manufacturing units, ATMP units, special sub-assemblies and capital goods for the manufacturing of the above items.
Modified Electronics Manufacturing Clusters (EMC 2.0) scheme was also notified in 2020 to provide support for creating world-class infrastructure with common facilities and amenities including Ready Built Factory (RBF) sheds and Plug and Play facilities to attract leading companies worldwide. Electronics manufacturers will set up units in the country along with their supply chain.
